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SMT patch process
Time:2021-10-08 Read: 1687

SMT basic process components include: screen printing (or dispensing), placement (curing), reflow soldering, cleaning, testing, and repair

1. Silk screen: Its function is to print solder paste or patch glue onto the PCB pads to prepare for the soldering of components. The equipment used is a screen printing machine (screen printing machine), located at the forefront of the SMT production line.

2. Dispensing: It is to drip glue onto the fixed position of the PCB board, and its main function is to fix the components on the PCB board. The equipment used is a glue dispenser, located at the forefront of the SMT production line or behind the testing equipment.

3. Mounting: Its function is to accurately mount the surface mount components to the fixed position of the PCB. The equipment used is a placement machine, located behind the screen printing machine in the SMT production line.

 4. Curing: Its function is to melt the patch glue, so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a curing oven, located behind the placement machine in the SMT production line.

5. Reflow soldering: Its function is to melt the solder paste, so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a reflow oven, located behind the placement machine in the SMT production line.

6. Cleaning: Its function is to eliminate the harmful welding residues such as flux on the assembled PCB board. The equipment used is a washing machine, and the location may not be fixed, it may be online or offline.

7. Inspection: Its function is to inspect the welding quality and assembly quality of the assembled PCB board. The equipment used includes magnifying glass, microscope, online tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY inspection system, functional tester, etc. The location can be configured in a suitable place on the production line according to the needs of the inspection.

8. Rework: Its function is to rework the PCB boards that have failed to detect faults. The tools used are soldering irons, rework stations, etc. Configured at any position in the production line.

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